₺15,000 hour Removing the SixNy layer from the Si surface by scratching quantity Add to cart Description Description Service Device/System: Picosecond laser for contact opening and material removal/cutting Related products Production of thin film Si on Si wafer ₺50,000 SIPV Production of thin film Si on Si wafer quantity Add to cart Mono Si wafer patterning (forming Pyramid structures on the surface) ₺3,000 SIPV Mono Si wafer patterning (forming Pyramid structures on the surface) quantity Add to cart Oxidation of Si surface by thermal method ₺5,000 SIPV Oxidation of Si surface by thermal method quantity Add to cart Boron (B) or Phosphorus (P) doping process ₺15,000 SIPV Boron (B) or Phosphorus (P) doping process quantity Add to cart